ELECTRONIC DEVICE INCLUDING A HEAT DISSIPATION DEVICE FORMED OF NONMETALLIC MATERIAL

A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the f...

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Bibliographische Detailangaben
Hauptverfasser: KIM, Jihong, MOON, Hongki, KOO, Kyungha, JANG, Seyoung, YUN, Hajoong, LEE, Haejin, KIM, Kuntak
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.