COMPONENT CARRIER AND METHOD OF MANUFACTURING THE SAME

The present invention relates to a component carrier (1) comprising a stack comprising at least one electrically conductive layer structure (2) and at least one electrically insulating layer structure (3); a barrier structure (4); and a component (5) having at least one pad (6) and being embedded in...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	Moitzi, Heinz
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present invention relates to a component carrier (1) comprising a stack comprising at least one electrically conductive layer structure (2) and at least one electrically insulating layer structure (3); a barrier structure (4); and a component (5) having at least one pad (6) and being embedded in the stack and/or in the barrier structure (4). At least a portion of at least one of the at least one electrically conductive layer structure (2) and the at least one pad (6) comprises copper in contact with the barrier structure (4).