COMPACT LAMINATED COMPONENT CARRIER WITH FRONT END CHIP AND IMPEDANCE MATCHING CIRCUITRY FOR ANTENNA COMMUNICATION

COMPACT LAMINATED COMPONENT CARRIER WITH FRONT END CHIP AND IMPEDANCE MATCHING CIRCUITRY FOR ANTENNA COMMUNICATION

A component carrier (100) which comprises a laminated stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), a front end chip (108) on and/or in the stack (102) and extending at least up to a main surface o...

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Bibliographische Detailangaben
1. Verfasser: Weis, Gerald
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:A component carrier (100) which comprises a laminated stack (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), a front end chip (108) on and/or in the stack (102) and extending at least up to a main surface of the stack (102), an antenna interface (110) on an opposing other main surface of the stack (102), and an impedance matching circuitry (112) in the stack (102) and arranged vertically between the front end chip (108) and the antenna interface (110).