DIE BOND HEAD APPARATUS WITH DIE HOLDER MOTION TABLE

DIE BOND HEAD APPARATUS WITH DIE HOLDER MOTION TABLE

A die bond head apparatus has a die bond head body (1) coupled to a die bond head motion table (2), a die holder motion table (3) mounted on the die bond head body (1) and a die holder (4) which is operative in use to secure a semiconductor die to a substrate. The die holder is positionable by the d...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Yung, Chung Sheung, Leung, Pak Kin
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A die bond head apparatus has a die bond head body (1) coupled to a die bond head motion table (2), a die holder motion table (3) mounted on the die bond head body (1) and a die holder (4) which is operative in use to secure a semiconductor die to a substrate. The die holder is positionable by the die holder motion table independently of the die bond head motion table (2).