LAYERED-TYPE LIGHT-RECEIVING SENSOR AND ELECTRONIC DEVICE

Advanced processing is performed in a chip. A stacked light-receiving sensor according to an embodiment includes a first substrate (100, 200, 300) and a second substrate (120, 320) bonded to the first substrate. The first substrate includes a pixel array (101) in which a plurality of unit pixels are...

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Bibliographische Detailangaben
1. Verfasser:	EKI, Ryoji
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS COMPUTING COUNTING ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Advanced processing is performed in a chip. A stacked light-receiving sensor according to an embodiment includes a first substrate (100, 200, 300) and a second substrate (120, 320) bonded to the first substrate. The first substrate includes a pixel array (101) in which a plurality of unit pixels are arranged in a two-dimensional matrix. The second substrate includes a converter (17) configured to convert an analog pixel signal output from the pixel array to digital image data and a processing unit (15) configured to perform a process based on a neural network calculation model for data based on the image data. At least a part of the converter is arranged on a first side in the second substrate. The processing unit is arranged on a second side opposite to the first side in the second substrate.