ADHESIVE DISPENSE UNIT

This disclosure relates to an adhesive dispense unit for a semiconductor die bonding apparatus, the adhesive dispense unit comprising: an adhesive dispense nozzle; and a pin member; the pin member comprising a down stand portion and a sheath portion, and wherein the down stand is reciprocateable wit...

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Bibliographische Detailangaben
Hauptverfasser:	ter Steeg, Theo, Eltink, Erik
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	This disclosure relates to an adhesive dispense unit for a semiconductor die bonding apparatus, the adhesive dispense unit comprising: an adhesive dispense nozzle; and a pin member; the pin member comprising a down stand portion and a sheath portion, and wherein the down stand is reciprocateable within the sheath portion.