INTEGRATED CIRCUIT PACKAGE COMPRISING ENHANCED ELECTROMAGNETIC SHIELD

INTEGRATED CIRCUIT PACKAGE COMPRISING ENHANCED ELECTROMAGNETIC SHIELD

Some features pertain to a package, comprising a substrate, an electronic component coupled to the substrate, a mold at least partially surrounding the electronic component and a first shield over the mold, and a second shield over the first shield, the first shield made of a material selected to ha...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: LU, Chunrong, AN, Li, KREFFT, Anna Katharina
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Some features pertain to a package, comprising a substrate, an electronic component coupled to the substrate, a mold at least partially surrounding the electronic component and a first shield over the mold, and a second shield over the first shield, the first shield made of a material selected to have a high permeability shield. The package includes an enhanced electromagnetic shield.