PRINTED CIRCUIT BOARD

There is provided a printed circuit board that makes it possible to prevent vibration of a specific substrate from being amplified without increasing an entire weight. The printed circuit board includes: a first insulating substrate (6) having a mounting hole (15) that penetrates through the first i...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SASAKI, Shunsuke, SATO, Kohei, FUJIMA, Yoshiko, MORIMOTO, Yusuke, ASAI, Toshiki
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:There is provided a printed circuit board that makes it possible to prevent vibration of a specific substrate from being amplified without increasing an entire weight. The printed circuit board includes: a first insulating substrate (6) having a mounting hole (15) that penetrates through the first insulating substrate (6) from a first surface (6a) to a second surface (6b) and has a width larger in a second direction than in a first direction orthogonal to the second direction; a second insulating substrate (18) including a connection portion that penetrates through the mounting hole (15) from the first surface (6a) side and protrudes from the second surface (6b); a first electrode that is provided on the second surface (6b) and is disposed at an edge of the mounting hole (15) along the second direction; a second electrode that is provided on the connection portion and is joined to the first electrode by solder; and an electronic component (30) provided on the second surface (6b). A center of mass of the second insulating substrate (18) is disposed on the first surface (6a) side of the first insulating substrate (6). A center of mass of the electronic component (30) is disposed on the second surface (6b) side of the first insulating substrate (6). The electronic component (30) has a weight equivalent to a weight of the second insulating substrate (18) .