ADHESIVE COMPOSITION

The present application relates to an epoxy-based adhesive composition. The present application can provide excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.

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Bibliographische Detailangaben
1. Verfasser:	KO, Min Jin
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present application relates to an epoxy-based adhesive composition. The present application can provide excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.