COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING COPPER-CLAD LAMINATE

Provided are a copper-clad laminate including an insulating layer containing a resin and a copper foil arranged on at least one surface of the insulating layer, wherein the copper foil is a surface-treated copper foil having a metal-treated layer containing zinc, and a content of zinc in the metal-t...

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Bibliographische Detailangaben
Hauptverfasser:	SHIRAOKAWA, Yoshikatsu, KAMOSHIDA, Shinichi, KUROKAWA, Hiroshi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided are a copper-clad laminate including an insulating layer containing a resin and a copper foil arranged on at least one surface of the insulating layer, wherein the copper foil is a surface-treated copper foil having a metal-treated layer containing zinc, and a content of zinc in the metal-treated layer is 10 to 2,500 µg/dm2; a method for producing the copper-clad laminate; and a printed wiring board and a semiconductor package using the copper-clad laminate.