WALL DEPOSITION
A method of forming a wall structure on a substrate comprises depositing, by additive-layer, powder-fed, laser-weld deposition apparatus, a plurality of material layers overlying one another on the substrate to form the wall structure. Each material layer of the plurality of material layers has (a)...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | A method of forming a wall structure on a substrate comprises depositing, by additive-layer, powder-fed, laser-weld deposition apparatus, a plurality of material layers overlying one another on the substrate to form the wall structure. Each material layer of the plurality of material layers has (a) a layer thickness, measured in a direction locally perpendicular to a profile of the substrate, of no greater than about 350 µm and (b) a layer width, measured in a direction locally parallel to the profile of the substrate, of no greater than about 1200 µm. |
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