PROTECTIVE FILM FORMING AGENT, METHOD FOR PRODUCING SEMICONDUCTOR CHIP, AND METHOD FOR PRODUCING (METH)ACRYLIC RESIN
To provide a protective film forming agent that is less likely to cause an excessive increase in viscosity when a solid content concentration thereof is raised, a method for producing a semiconductor chip using the protective film forming agent, and a method for producing a (meth)acrylic resin that...
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| creator | UEMATSU, Teruhiro |
| description | To provide a protective film forming agent that is less likely to cause an excessive increase in viscosity when a solid content concentration thereof is raised, a method for producing a semiconductor chip using the protective film forming agent, and a method for producing a (meth)acrylic resin that can be preferably used as a component of the aforementioned protective film forming agent. In a protective film forming agent containing a water-soluble resin (A), light absorber (B) and solvent (S), a (meth)acrylic resin including a structural unit derived from a (meth)acrylamide derivative of a specific structure including an alicyclic structure is used as the water-soluble resin (A). |
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| language | eng ; fre ; ger |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES |
| title | PROTECTIVE FILM FORMING AGENT, METHOD FOR PRODUCING SEMICONDUCTOR CHIP, AND METHOD FOR PRODUCING (METH)ACRYLIC RESIN |
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