PROTECTIVE FILM FORMING AGENT, METHOD FOR PRODUCING SEMICONDUCTOR CHIP, AND METHOD FOR PRODUCING (METH)ACRYLIC RESIN

PROTECTIVE FILM FORMING AGENT, METHOD FOR PRODUCING SEMICONDUCTOR CHIP, AND METHOD FOR PRODUCING (METH)ACRYLIC RESIN

To provide a protective film forming agent that is less likely to cause an excessive increase in viscosity when a solid content concentration thereof is raised, a method for producing a semiconductor chip using the protective film forming agent, and a method for producing a (meth)acrylic resin that...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: UEMATSU, Teruhiro
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:To provide a protective film forming agent that is less likely to cause an excessive increase in viscosity when a solid content concentration thereof is raised, a method for producing a semiconductor chip using the protective film forming agent, and a method for producing a (meth)acrylic resin that can be preferably used as a component of the aforementioned protective film forming agent. In a protective film forming agent containing a water-soluble resin (A), light absorber (B) and solvent (S), a (meth)acrylic resin including a structural unit derived from a (meth)acrylamide derivative of a specific structure including an alicyclic structure is used as the water-soluble resin (A).