POLISHING COMPOSITION

Provided is a polishing means that can improve the flatness of a substrate without significantly reducing the polishing speed. More specifically, provided is a polishing composition comprising inorganic particles, water, and a water-soluble polymer, wherein (i) a 1 mass (wt/wt)% aqueous solution of...

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Bibliographische Detailangaben
Hauptverfasser: MASUDA, Tsuyoshi, NISHIGUCHI, Hideaki
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:Provided is a polishing means that can improve the flatness of a substrate without significantly reducing the polishing speed. More specifically, provided is a polishing composition comprising inorganic particles, water, and a water-soluble polymer, wherein (i) a 1 mass (wt/wt)% aqueous solution of the water-soluble polymer has a normal stress (N) of 1 or more at a shear rate of 10000 (1/S), or (ii) a 0.25 mass (wt/wt)% aqueous solution of the water-soluble polymer has a normal stress (N) of 1 or more at a shear rate of 10000 (1/S).