THERMALLY-CONDUCTIVE CURABLE COMPOSITION

The present disclosure relates to a thermally-conductive curable composition comprising:a) a base component comprising a cationically self-curable silicone-based oligomeric compound;b) a curing system for the cationically self-curable silicone-based oligomeric compound; andc) a thermally-conductive...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Goeb, Siegfried Rainer, Jurjevic, Simone, Eichler, Jens, Gorgoll, Ricardo Mizoguchi, Steiger, Wolf, Bissinger, Peter
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present disclosure relates to a thermally-conductive curable composition comprising:a) a base component comprising a cationically self-curable silicone-based oligomeric compound;b) a curing system for the cationically self-curable silicone-based oligomeric compound; andc) a thermally-conductive filler.According to another aspect, the present disclosure is directed to a method of manufacturing a thermally-conductive curable composition. In yet another aspect, the disclosure relates to the use of a thermally-conductive curable composition for industrial applications, in particular for thermal management applications in the automotive industry.