WIRING BOARD

A wiring board 1 of the present disclosure comprises an insulating layer 3, a first conductor layer 9 located on the surface of the insulating layer 3 and containing any one of nickel and chromium, a metal belonging to group 4 of the periodic table; or a metal belonging to group 6 of the periodic ta...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: YUGAWA, Hidetoshi
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A wiring board 1 of the present disclosure comprises an insulating layer 3, a first conductor layer 9 located on the surface of the insulating layer 3 and containing any one of nickel and chromium, a metal belonging to group 4 of the periodic table; or a metal belonging to group 6 of the periodic table, a second conductor layer 10 located inside the outer circumferential edge on the first conductor layer 9 and containing copper, a third conductor layer 11 located on the surface of the insulating layer 3 in a state of covering the first conductor layer and the second conductor layer and containing nickel, and a fourth conductor layer 12 located in a state of covering the third conductor layer 11 and containing gold. The third conductor layer 11 has an overhanging part 11a extending outward from the outer circumferential edge of the first conductor layer 9, and the fourth conductor layer 12 is located between the overhanging part 11a and the insulating layer 3.