FLEXIBLE SUBSTRATE AND PREPARATION METHOD THEREFOR, AND FLEXIBLE ELECTRONIC DEVICE

Embodiments of the present disclosure disclose a flexible substrate and a method for manufacturing the same, and a flexible electronic device. The flexible substrate includes: a flexible base (100); a plurality of electronic components (200) disposed on the flexible base (100), a gap (10) being formed between each two adjacent electronic components of the plurality of electronic components (200); and a plurality of metal lines (20), wherein at least one end of each of the metal lines (20) is connected to the corresponding electronic component (200), at least a portion of the plurality of metal lines (20) are disposed in the gap (10), and a length of each metal line (20) disposed in the gap (10) is greater than a width of the gap (10) in an extension direction of the metal line (20); wherein a first filling layer (300) is disposed in the gap (10) to wrap the metal line (20) disposed in the gap (10). Therefore, the metal line structure may be protected by the first filling layer to prevent the metal lines from being damaged due to friction or adhesion with other structures during stretching.