HIGHLY FILLED PLASTISOLS

The present application discloses low cost plastisols with high filler loading and gel points below 77° C.

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Bibliographische Detailangaben
1. Verfasser:	SCHILLING, Curtis Louis, III
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present application discloses low cost plastisols with high filler loading and gel points below 77° C.