PREPREG AND PRODUCTION METHOD THEREFOR, SLIT TAPE PREPREG, CARBON FIBER-REINFORCED COMPOSITE MATERIAL
An object of the present invention is to provide a prepreg having a high processability and laminating performance in an automated lay-up device and serving to produce a cured product having good physical properties, and also provide a method for the production thereof. A prepreg comprising at least...
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Zusammenfassung: | An object of the present invention is to provide a prepreg having a high processability and laminating performance in an automated lay-up device and serving to produce a cured product having good physical properties, and also provide a method for the production thereof. A prepreg comprising at least the components [A] to [E] listed blow and having a structure incorporating a first layer composed mainly of the component [A] and a first epoxy resin composition that contains the components [B] to [D] but is substantially free of the component [E] and a second layer composed mainly of a second epoxy resin composition that contains the components [B] to [E] and disposed adjacent to each surface of the first layer, the second epoxy resin composition being characterized in that its component [D] accounts for 1 part by mass or more and less than 5 parts by mass relative to the total quantity of its components [B] to [E], which accounts for 100 parts by mass, and also characterized by having a storage elastic modulus G' at 25°C of 8.0 × 105 to 6.0 × 106 Pa as measured at an angular frequency of 3.14 rad/s, giving a value of 0.085 or more as calculated by the equation (1) specified below, and having a component [D] content of 1 part by mass or more and less than 10 parts by mass relative to the total quantity of the first epoxy resin composition and the second epoxy resin composition, which accounts for 100 parts by mass:[A] carbon fiber,[B] epoxy resin,[C] curing agent,[D] thermoplastic resin, and[E] particles containing a thermoplastic resin as primary component and having a volume-average particle diameter of 5 to 50 µm.[Mathematical formula 1] log10G′Paat25°C−log10G′Paat40°C15 |
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