ADHESIVELY BONDED JOINT

The subject invention provides a component with an adhesively bonded bi-material joint and a method of forming the component with an adhesively bonded bi-material joint. The component includes a first part and a second part formed of the same metal material and a third part formed of a dissimilar metal material. The first part includes a channel and the second part is sized to fit over the channel. During formation of the component, a layer of adhesive is disposed within the channel and the third part is seated therein. Another layer of adhesive is then placed on a top portion of the third part and the second part is placed thereon until it abuts the first part such that the third part is spaced from both the first part and the second part by the adhesive layer. The first part and second part are then joined at connection surfaces.