EMBOSSING METHOD FOR EMBOSSING MICRO- OR NANOSTRUCTURES
The invention relates to a method for embossing structures with dimensions in the micrometer or nanometer range in a layer of varnish (6) composed of a varnish. The layer of varnish (6) is applied to one side of a film web (5) and can be hardened by means of ultraviolet radiation. The film web (5) i...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | The invention relates to a method for embossing structures with dimensions in the micrometer or nanometer range in a layer of varnish (6) composed of a varnish. The layer of varnish (6) is applied to one side of a film web (5) and can be hardened by means of ultraviolet radiation. The film web (5) is arranged in the conveying direction initially on one side, on which the layer of varnish which is yet to harden is applied, pressed through a presser (2) on an embossing cylinder (1) on which surface the structures which are to be stamped in the micrometer or nanometer region are arranged. This forms the structures in the micrometer range or in the nanometer range in the layer of varnish. Subsequently, the layer of varnish (6) is hardened by ultraviolet radiation from a source for ultraviolet radiation. According to the invention, the film web (5) is guided to the stamping cylinder (1) from above or at least obliquely from above. |
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