COVER ASSEMBLY WITH AT LEAST ONE IMPEDANCE CONTROL STRUCTURE

The object of the present invention is to provide a cover assembly (1) for at least one bond location (42) between at least two electrical conductors (5) of a high-frequency data transmission line, wherein the cover assembly (1) results in improved transmission performance in terms of signal integrity. The object is achieved by providing at least one impedance control structure (46) in the cover assembly (1) comprising a protective cover (4) and the at least two electrical conductors (5) for conducting electrical signals, wherein the at least two electrical conductors (5) extend through the protective cover (4) and are overlappingly bonded to each other at the at least one bond location (42). Since the at least one bond location (42) has an increased cross-sectional area and is located within the protective cover (4), it effects the impedance of the at least two electrical conductors (5). The at least one impedance control structure (46) is used to compensate for this effect. Thus, the impedance of the at least two electrical conductors (5) can be matched with the impedance of a corresponding signal receiver in order to prevent signal reflection and maintain signal integrity.