RESIN COMPOSITION, LAMINATE, RESIN COMPOSITION LAYER-ATTACHED SEMICONDUCTOR WAFER, SUBSTRATE FOR MOUNTING RESIN COMPOSITION LAYER-ATTACHED SEMICONDUCTOR, AND SEMICONDUCTOR DEVICE

A resin composition that has both excellent flux activity and high insulation reliability, that possesses good storage stability, and that further has flexibility with good operability upon being used as a laminate is provided. The resin composition of the present invention contains a chelating flux...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TAKIGUCHI, Takenori, HIGASHIGUCHI, Kohei, OKANIWA, Masashi, KIDA, Tsuyoshi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A resin composition that has both excellent flux activity and high insulation reliability, that possesses good storage stability, and that further has flexibility with good operability upon being used as a laminate is provided. The resin composition of the present invention contains a chelating flux agent (A), a thermal radical polymerization initiator (B) and a radical polymerizable compound (C).