POLYMERS INCLUDING ONE OR MORE 1,1-DISUBSTITUTED ALKENE COMPOUNDS AND POLYMER COMPOSITIONS THEREOF
The disclosure relates to a copolymer comprising from 2 weight percent to 98 weight percent of a first monomer, and from 2 weight percent to 98 weight percent of a second monomer; wherein the first monomer is a first 1, 1-disubstituted alkene monomer, and the second monomer is a second 1, 1-disubsti...
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| creator | PALSULE, Aniruddha S PARAB, Kshitij K HOLZER, Alexander R SULLIVAN, Jeffrey M STEVENSON, Peter R |
| description | The disclosure relates to a copolymer comprising from 2 weight percent to 98 weight percent of a first monomer, and from 2 weight percent to 98 weight percent of a second monomer; wherein the first monomer is a first 1, 1-disubstituted alkene monomer, and the second monomer is a second 1, 1-disubstituted alkene monomer, wherein the first monomer has a structure such that homopolymers of the first monomer have a Tg of 25 °C or more as measured by differential scanning calorimetry (DSC); and the second monomer has a structure such that homopolymers of the second monomer have a Tg of 15 °C or less as measured by DSC. |
| format | Patent |
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STEVENSON, Peter R</creatorcontrib><description>The disclosure relates to a copolymer comprising from 2 weight percent to 98 weight percent of a first monomer, and from 2 weight percent to 98 weight percent of a second monomer; wherein the first monomer is a first 1, 1-disubstituted alkene monomer, and the second monomer is a second 1, 1-disubstituted alkene monomer, wherein the first monomer has a structure such that homopolymers of the first monomer have a Tg of 25 °C or more as measured by differential scanning calorimetry (DSC); and the second monomer has a structure such that homopolymers of the second monomer have a Tg of 15 °C or less as measured by DSC.</description><language>eng ; fre ; ger</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210303&DB=EPODOC&CC=EP&NR=3786199A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210303&DB=EPODOC&CC=EP&NR=3786199A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>PALSULE, Aniruddha S</creatorcontrib><creatorcontrib>PARAB, Kshitij K</creatorcontrib><creatorcontrib>HOLZER, Alexander R</creatorcontrib><creatorcontrib>SULLIVAN, Jeffrey M</creatorcontrib><creatorcontrib>STEVENSON, Peter R</creatorcontrib><title>POLYMERS INCLUDING ONE OR MORE 1,1-DISUBSTITUTED ALKENE COMPOUNDS AND POLYMER COMPOSITIONS THEREOF</title><description>The disclosure relates to a copolymer comprising from 2 weight percent to 98 weight percent of a first monomer, and from 2 weight percent to 98 weight percent of a second monomer; 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PARAB, Kshitij K ; HOLZER, Alexander R ; SULLIVAN, Jeffrey M ; STEVENSON, Peter R</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3786199A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2021</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>PALSULE, Aniruddha S</creatorcontrib><creatorcontrib>PARAB, Kshitij K</creatorcontrib><creatorcontrib>HOLZER, Alexander R</creatorcontrib><creatorcontrib>SULLIVAN, Jeffrey M</creatorcontrib><creatorcontrib>STEVENSON, Peter R</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>PALSULE, Aniruddha S</au><au>PARAB, Kshitij K</au><au>HOLZER, Alexander R</au><au>SULLIVAN, Jeffrey M</au><au>STEVENSON, Peter R</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLYMERS INCLUDING ONE OR MORE 1,1-DISUBSTITUTED ALKENE COMPOUNDS AND POLYMER COMPOSITIONS THEREOF</title><date>2021-03-03</date><risdate>2021</risdate><abstract>The disclosure relates to a copolymer comprising from 2 weight percent to 98 weight percent of a first monomer, and from 2 weight percent to 98 weight percent of a second monomer; wherein the first monomer is a first 1, 1-disubstituted alkene monomer, and the second monomer is a second 1, 1-disubstituted alkene monomer, wherein the first monomer has a structure such that homopolymers of the first monomer have a Tg of 25 °C or more as measured by differential scanning calorimetry (DSC); and the second monomer has a structure such that homopolymers of the second monomer have a Tg of 15 °C or less as measured by DSC.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | POLYMERS INCLUDING ONE OR MORE 1,1-DISUBSTITUTED ALKENE COMPOUNDS AND POLYMER COMPOSITIONS THEREOF |
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