POLYMERS INCLUDING ONE OR MORE 1,1-DISUBSTITUTED ALKENE COMPOUNDS AND POLYMER COMPOSITIONS THEREOF

The disclosure relates to a copolymer comprising from 2 weight percent to 98 weight percent of a first monomer, and from 2 weight percent to 98 weight percent of a second monomer; wherein the first monomer is a first 1, 1-disubstituted alkene monomer, and the second monomer is a second 1, 1-disubsti...

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Bibliographische Detailangaben
Hauptverfasser:	PALSULE, Aniruddha S, PARAB, Kshitij K, HOLZER, Alexander R, SULLIVAN, Jeffrey M, STEVENSON, Peter R
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The disclosure relates to a copolymer comprising from 2 weight percent to 98 weight percent of a first monomer, and from 2 weight percent to 98 weight percent of a second monomer; wherein the first monomer is a first 1, 1-disubstituted alkene monomer, and the second monomer is a second 1, 1-disubstituted alkene monomer, wherein the first monomer has a structure such that homopolymers of the first monomer have a Tg of 25 °C or more as measured by differential scanning calorimetry (DSC); and the second monomer has a structure such that homopolymers of the second monomer have a Tg of 15 °C or less as measured by DSC.