THERMOSETTING COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, PRINTED WIRING BOARD, AND MULTILAYER PRINTED WIRING BOARD

A thermosetting composition comprising at least a thermosetting compound, the thermosetting composition satisfying relationships represented by formulas (i) and (ii) below: 0.80≤b/a≤0.98 and 0.05≤c/a≤0.30 wherein a, b, and c represent storage moduli (unit: GPa) at 30°C, 100°C, and 260°C, respectivel...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAGUCHI, Shohei, TOMIZAWA, Katsuya, TADOKORO, Hiroaki, KAWAI, Hidetoshi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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Beschreibung
Zusammenfassung:	A thermosetting composition comprising at least a thermosetting compound, the thermosetting composition satisfying relationships represented by formulas (i) and (ii) below: 0.80≤b/a≤0.98 and 0.05≤c/a≤0.30 wherein a, b, and c represent storage moduli (unit: GPa) at 30°C, 100°C, and 260°C, respectively, of a cured product formed by curing a prepreg obtained by impregnating or coating a base material with the thermosetting composition.