SYSTEM FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICES

A system (600) for performing a direct transfer of a plurality of semiconductor die from a first substrate (606) to a second substrate (608), the system comprising a first conveyance mechanism to convey the first substrate; a second conveyance mechanism to convey the second substrate; a transfer mechanism (610) disposed adjacent to the first conveyance mechanism to effectuate the direct transfer; and a controller (602). The controller having executable instructions, which cause one or more processors to perform operations including: determining positions of the plurality of semiconductor die based at least in part on map data describing the positions of the plurality of semiconductor die of a semiconductor wafer, conveying at least one of the first substrate or the second substrate such that the first substrate, the second substrate, and the transfer mechanism are in a direct transfer position, and activating the transfer mechanism to perform the direct transfer of the plurality of semiconductor die.