MOLD SYSTEM

Provided is a mold system including a mold device that has a stationary mold and a movable mold and includes a cavity space formed inside by the stationary mold and the movable mold and a gas vent that allows the cavity space and an external space to communicate with each other; a mold device temper...

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Bibliographische Detailangaben
Hauptverfasser:	NAMATAME, Akira, SHISHIDO, Yoshiko, KUDOU, Yuuki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	Provided is a mold system including a mold device that has a stationary mold and a movable mold and includes a cavity space formed inside by the stationary mold and the movable mold and a gas vent that allows the cavity space and an external space to communicate with each other; a mold device temperature adjusting mechanism that adjusts a temperature of the mold device; and a gas vent heating mechanism that heats the gas vent.