PACKAGE FOR ELECTRIC DEVICE AND METHOD OF MANUFACTURING THE PACKAGE

A package for an electric device is proposed based on a substrate (SU, SU1, SU2) that comprises at least a piezoelectric layer. Device structures are enclosed in a cavity of an integrally formed package layer structure (PK) of a thin film package applied on the first surface (SI). A first contact pad (PI) is arranged on the first surface of the substrate and electrically connected to the device structures. A second contact pad (P2) is arranged on a second surface (S2) of the substrate opposite to the first surface (SI). A via (V) is guided through the substrate and interconnects first and second contact pads electrically. Packages may be stacked on one another and connected via two pads of different kind. The first substrate (SU1) is connected via its second pad (P2) on the second surface thereof to the first pad of a second substrate (SU2) by means of connection means (CM).