METHOD FOR MANUFACTURING VIAS PASSING THROUGH A SUBSTRATE

METHOD FOR MANUFACTURING VIAS PASSING THROUGH A SUBSTRATE

A method of manufacturing at least one element crossing a substrate, including a step of electrodeposition of at least a portion of said element in an opening crossing the substrate and on a portion of a conductive seed layer located on said at least a portion of a surface of the substrate, said see...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: PARES, Gabriel
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of manufacturing at least one element crossing a substrate, including a step of electrodeposition of at least a portion of said element in an opening crossing the substrate and on a portion of a conductive seed layer located on said at least a portion of a surface of the substrate, said seed layer portion being located on a same side of the opening as said surface of the substrate.