A CURABLE HOTMELT SILICONE COMPOSITION, ENCAPSULANT, FILM AND OPTICAL SEMICONDUCTOR DEVICE

[Problem] The provision of a curable hot-melt silicone composition that can exhibit excellent mechanical properties, particularly strength and extension, even when formed in a film or sheet shape.[Solution] The abovementioned problem is solved by a solvent-free curable hot-melt silicone composition...

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Bibliographische Detailangaben
Hauptverfasser:	TAKEUCHI, Shunya, KOBAYASHI, Akihiko, HAYASHI, Akito, INAGAKI, Sawako
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	[Problem] The provision of a curable hot-melt silicone composition that can exhibit excellent mechanical properties, particularly strength and extension, even when formed in a film or sheet shape.[Solution] The abovementioned problem is solved by a solvent-free curable hot-melt silicone composition that contains (A) alkenyl group-containing organopolysiloxane having at least 2 alkenyl groups per molecule, (B) branched organohydrogenpolysiloxane having at least 2 silicon-bonded hydrogen atoms per molecule, at 0.1 to 5% by mass relative to the total mass of the composition, (C) additive represented by average unit formula (C-1), (D) hydrosilylation catalyst, and (E) silica.