A CURABLE SILICONE COMPOSITION, OPTICAL SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

[Problem] The provision of a curable silicone composition to be used for encapsulating, coating or adhering an optical semiconductor element, where the curable silicone composition can form a cured product with sufficiently low gas-permeability, and with little weight decrease and little change in h...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TAKEUCHI, Shunya, HAYASHI, Akito, INAGAKI, Sawako
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:[Problem] The provision of a curable silicone composition to be used for encapsulating, coating or adhering an optical semiconductor element, where the curable silicone composition can form a cured product with sufficiently low gas-permeability, and with little weight decrease and little change in hardness even on long-term exposure to high temperatures.[Solution] The abovementioned problem can be solved by a curable silicone composition comprising resinous organopolysiloxane that contains at least one (Ar2SiO2/2) unit (Ar denotes aryl group).