PROTECTIVE FILM

A protective film 10 of the present invention includes a base material layer and a pressure sensitive adhesive layer, and is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21. The pressure sensitive adhesive layer contains a polyolefin ha...

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Bibliographische Detailangaben
Hauptverfasser: ONODERA, Kazufusa, INABA, Hironari
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A protective film 10 of the present invention includes a base material layer and a pressure sensitive adhesive layer, and is used by being attached to a resin substrate 21 at the time of performing heat bending on the resin substrate 21. The pressure sensitive adhesive layer contains a polyolefin having a melting point of lower than 125°C. The base material layer has a first layer which contains a polyolefin having a melting point of 150°C or higher, and a second layer which contains an adhesive resin. In a case of heating the protective film 100 having such a configuration, in a state of being interposed between two attaching substrates which are formed of polycarbonate, at 145°C for 30 minutes, peeling off one attaching substrate on the side of the pressure sensitive adhesive layer at 25°C, and then viewing a surface of the one attaching substrate in a plan view, a residual ratio of an area where the pressure sensitive adhesive layer remains is 5% or less.