DIELECTRIC BARRIER DISCHARGE PLASMA REACTOR AND METHOD FOR PLASMA-ENHANCED VAPOR DEPOSITION

The present invention relates to a dielectric barrier discharge plasma reactor and a method for plasma enhanced chemical vapor deposition of coating on a substrate under atmospheric pressure. The reactor comprises a first electrode, a second electrode separated from the first electrode for forming a...

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Bibliographische Detailangaben
Hauptverfasser: Remy, Antoine, RENIERS, François
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:The present invention relates to a dielectric barrier discharge plasma reactor and a method for plasma enhanced chemical vapor deposition of coating on a substrate under atmospheric pressure. The reactor comprises a first electrode, a second electrode separated from the first electrode for forming a plasma area, and a first dielectric layer at least partially covering the first electrode. An induction heating coil located outside the plasma area is configured for heating by induction a substrate when placed in the plasma area and/or for heating a susceptor by induction when placed in the plasma area. The induction heating coil comprises a plurality of windings around a central coil axis. The first electrode further comprises a through-hole extending along the central coil axis, such that magnetic field lines generated along the central coil axis by the induction heating coil are passing through the through-hole.