ELECTRICALLY PEELABLE ADHESIVE SHEET, JOINED BODY, AND PEELING METHOD FOR JOINED BODY

An object of a first embodiment of the present invention is to provide an electrical debonding type adhesive sheet which can be applied while inhibiting the trapping of air bubbles and while easily avoiding surface irregularities, etc., and which gives a joined body that can be easily debonded. The...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MIZOBATA, Kaori, AKAMATSU, Kaori, AWANE, Ryo, HIRAO, Akira, YOKOYAMA, Junji
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES TRANSPORTING USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An object of a first embodiment of the present invention is to provide an electrical debonding type adhesive sheet which can be applied while inhibiting the trapping of air bubbles and while easily avoiding surface irregularities, etc., and which gives a joined body that can be easily debonded. The electrical debonding type adhesive sheet according to the first embodiment of the present invention includes a substrate for voltage application, a first adhesive layer, which is constituted of an electrically debondable adhesive and is formed on an electroconductive surface of the substrate for voltage application, and a second adhesive layer, which is formed on the opposite surface of the substrate for voltage application, the electrical debonding type adhesive sheet including a plurality of linked parts and a linking part which links the plurality of linked parts to each other.