TEMPORARILY BONDED BODY COMPOSED OF CERAMIC RESIN COMPOSITE AND METAL PLATE; METHOD FOR MANUFACTURING THE SAME, AND TRANSPORTING SAID TEMPORARILY BONDED BODY

The purpose of the present invention is to inhibit breakage and degradation of a ceramic resin composite having low strength. Provided is a ceramic-metal temporary bonding body comprising: a ceramic resin composite in which a non-oxide ceramic sintered body is impregnated with a thermosetting resin...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KOGA, Ryuji, YOSHIMATU, Ryo, YAMAGATA, Toshitaka, INOUE, Saori, MINAKATA, Yoshitaka
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LIME, MAGNESIA MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS REFRACTORIES SEMICONDUCTOR DEVICES SLAG TRANSPORTING TREATMENT OF NATURAL STONE
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Beschreibung
Zusammenfassung:	The purpose of the present invention is to inhibit breakage and degradation of a ceramic resin composite having low strength. Provided is a ceramic-metal temporary bonding body comprising: a ceramic resin composite in which a non-oxide ceramic sintered body is impregnated with a thermosetting resin composition having cyanate groups in such a manner that a degree of cure calculated by differential scanning calorimetry is 5.0% or more and 70% or less; and a metal plate temporarily bonded to at least one surface of the ceramic resin composite. A shear bond strength between the ceramic resin composite and the metal plate is 0.1 MPa or more and 1.0 MPa or less.