METHODS FOR FABRICATING ULTRASOUND TRANSDUCER DEVICES

An ultrasound transducer device includes: a first insulating layer formed on a first integrated circuit substrate; a second insulating layer formed on the first insulating layer; a third insulating layer formed on the second insulating layer, and a second substrate bonded to the first integrated cir...

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Bibliographische Detailangaben
Hauptverfasser:	FIFE, Keith, G, LIU, Jianwei
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	FOR PERFORMING MECHANICAL WORK IN GENERAL GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS TRANSPORTING
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Beschreibung
Zusammenfassung:	An ultrasound transducer device includes: a first insulating layer formed on a first integrated circuit substrate; a second insulating layer formed on the first insulating layer; a third insulating layer formed on the second insulating layer, and a second substrate bonded to the first integrated circuit. A first cavity is formed in the third insulating layer. The second substrate is bonded to the first integrated circuit such that the first cavity is sealed.