THERMOSETTING ADHESIVE AND ADHESIVE TAPE MADE FROM SAME

An adhesive, more particularly a thermally curable, meltable, preferably pressure-sensitive adhesive, which is curable thermally from a temperature of 110° C., is storage-stable for approximately one month at 60° C. and longer than one year at 23° C., and an adhesive tape produced therefrom, compris...

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Bibliographische Detailangaben
Hauptverfasser:	DIETZE, Sebastian, ELSENBACH, Kim, SCHÜMANN, Uwe, BUGGY, Nicholas
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An adhesive, more particularly a thermally curable, meltable, preferably pressure-sensitive adhesive, which is curable thermally from a temperature of 110° C., is storage-stable for approximately one month at 60° C. and longer than one year at 23° C., and an adhesive tape produced therefrom, comprising an epoxide-functionalized acrylonitrile/butadiene copolymer having on average more than 1.5 epoxide groups per molecule, and the ground reaction product of phthalic anhydride and diethylenetriamine, for use in the automotive industry both in bodyshell construction on oiled metal sheets and in the coating line on cathodically electrocoated or otherwise-coated metal sheets, for bonding and/or sealing, for example for hem fold bonding, for hem fold sealing, for seam sealing, for underseal bonding, for hole stopping, and much more.