AN AQUEOUS, NOBLE METAL-FREE ACTIVATION COMPOSITION FOR ACTIVATING A SURFACE OF A NON-CONDUCTIVE SUBSTRATE FOR METALLIZATION

The present invention relates to an aqueous, noble metal-free activation composition for activating a surface of a non-conductive substrate for metallization, the composition comprising:at least one activator, selected as a conductive mixed oxide at a total concentration ranging from 0.1 wt.-% to 25...

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Bibliographische Detailangaben
Hauptverfasser: Brunner, Heiko, Donner, Constanze, Janßen, Knut-Arne, Kohlmann, Lars
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:The present invention relates to an aqueous, noble metal-free activation composition for activating a surface of a non-conductive substrate for metallization, the composition comprising:at least one activator, selected as a conductive mixed oxide at a total concentration ranging from 0.1 wt.-% to 25 wt.-% based on the total weight of the aqueous, noble metal-free activation composition.