AN AQUEOUS, NOBLE METAL-FREE ACTIVATION COMPOSITION FOR ACTIVATING A SURFACE OF A NON-CONDUCTIVE SUBSTRATE FOR METALLIZATION
The present invention relates to an aqueous, noble metal-free activation composition for activating a surface of a non-conductive substrate for metallization, the composition comprising:at least one activator, selected as a conductive mixed oxide at a total concentration ranging from 0.1 wt.-% to 25...
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Zusammenfassung: | The present invention relates to an aqueous, noble metal-free activation composition for activating a surface of a non-conductive substrate for metallization, the composition comprising:at least one activator, selected as a conductive mixed oxide at a total concentration ranging from 0.1 wt.-% to 25 wt.-% based on the total weight of the aqueous, noble metal-free activation composition. |
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