METHOD FOR APPLYING A MATERIAL CONTAINING A MELTABLE POLYMER

The invention relates to a method for applying a material containing a meltable polymer comprising the step of applying a filament of the at least partially molten material from a discharge opening of a discharge element onto a substrate. The meltable polymer has the following properties: -a melting...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ACHTEN, Dirk, BÜSGEN, Thomas, TILLACK, Jörg, MELCHIORS, Martin, ARNDT, Wolfgang, REICHERT, Peter, DEGIORGIO, Nicolas
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING USE OF MATERIALS AS ADHESIVES WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	The invention relates to a method for applying a material containing a meltable polymer comprising the step of applying a filament of the at least partially molten material from a discharge opening of a discharge element onto a substrate. The meltable polymer has the following properties: -a melting point (DSC, differential scanning calorimetry; second heating with a heating rate of 5° C./min) in a range from ≥40° C. to ≤120° C.; -a glass transition temperature (DMA, dynamic mechanical analysis in accordance with DIN EN ISO 6721-1:2011) in a range from ≥−70° C. to ≤30° C.; -a storage modulus G′ (parallel plate oscillation viscometer in accordance with ISO 6721-10:2015 at a frequency of 1/s) at 20° C. above the melting point of ≥1·104 Pa; -a storage modulus G′ (parallel plate oscillation viscometer in accordance with ISO 6721-10:2015 at a frequency of 1/s) at 10° C. below the melting point with prior heating to a temperature of 20° C. above the melting point and subsequent cooling with a cooling rate of 1° C./min of ≤1·107 Pa; wherein the filament has an application temperature of ≥100° C. above the melting point of the meltable polymer for ≤5 minutes during the application process and wherein the meltable polymer further has the property that the storage modulus G′ (parallel plate oscillation viscometer in accordance with ISO 6721-10:2015 at a frequency of 1/s) of the meltable polymer at the highest application temperature reached during the application process is smaller by a factor of ≥10 than the storage modulus G′ (parallel plate oscillation viscometer in accordance with ISO 6721-10:2015 at a frequency of 1/s) at a temperature of 20° C. above the melting point of the meltable polymer.