HEAT-INSULATION DEVICE AND ELECTRONIC PRODUCT

Disclosed in the present application are a heat-insulation device and an electronic product. The heat-insulation device is of a closed hollow structure, and comprises a first cover body and a second cover body arranged opposite to each other; a vacuum cavity is formed in the heat-insulation device; the first cover body is made of a heat-conducting material; a heat-conducting element is provided in the vacuum cavity, and a first end of the heat-conducting element is in contact with the inner wall surface of the first cover body. The present application can be applied in the field of the electronic products. By means of heat conduction by a first cover plate, the heat dissipation of a heating element is implemented; by means of heat insulation by the vacuum cavity, a heat-sensitive device is protected; and by means of the heat-conducting element, the adjustment of local temperature of the second cover body is implemented, and thermal balance of the heat-sensitive device or the entire machine is thus achieved.