THREE-DIMENSIONAL ELECTRONICS DISTRIBUTION BY GEODESIC FACETING

In one embodiment, a flexible circuit board includes a plurality of facet locations that each correspond to a particular one of a plurality of rigid sensor facets and a particular one of a plurality of rigid display facets. The flexible circuit board also includes a plurality of wire traces that ser...

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Bibliographische Detailangaben
Hauptverfasser:	LAMKIN, Jordan, David, LAMKIN, Mark, A, RINGGENBERG, Kyle, Martin
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	In one embodiment, a flexible circuit board includes a plurality of facet locations that each correspond to a particular one of a plurality of rigid sensor facets and a particular one of a plurality of rigid display facets. The flexible circuit board also includes a plurality of wire traces that serially connect the plurality of facet locations. The facet locations are arranged into a plurality of facet columns. When the flexible circuit board is flat, at least some of the facet locations are separated from one or more adjacent facet locations by a plurality of gaps. When the flexible circuit board is formed into a three-dimensional shape, the plurality of gaps are substantially eliminated, thereby permitting the plurality of rigid sensor facets to form a continuous sensing surface and the plurality of rigid display facets to form a continuous display surface.