CHIP AND PACKAGING METHOD

Embodiments of this application disclose a chip and a packaging method thereof. In the chip, first solder pads in a first solder pad array on a first substrate are attached to corresponding second pins in second pin arrays on different dies, to implement short-distance and high-density interconnecti...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FU, HuiLi, TAO, Junlei, CHIANG, Shanghsuan, XIE, Wenxu, ZHAO, Nan
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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