THERMALLY CONDUCTIVE COMPOSITION AND THERMALLY CONDUCTIVE MOLDED BODY

The present invention provides a thermally conductive composition in which the flexibility of the thermally conductive composition is not impaired, and even when cured into a thermally conductive molded body, good bendability, an excellent handling property, and excellent thermal conductivity are ex...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	UMETANI, Hiroshi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
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Beschreibung
Zusammenfassung:	The present invention provides a thermally conductive composition in which the flexibility of the thermally conductive composition is not impaired, and even when cured into a thermally conductive molded body, good bendability, an excellent handling property, and excellent thermal conductivity are exhibited, and provides a molded body of the thermally conductive composition. A thermally conductive composition, in which a thermally conductive filler is contained in a polymer matrix, includes a methyl phenyl silicone, characterized in that the thermally conductive filler has an average particle size of 10 to 100 µm, the content of the thermally conductive filler in the thermally conductive composition is 70% to 90% by volume, and 30% to 80% by volume of the thermally conductive filler has a particle size of 40 µm or more. A thermally conductive molded body is formed of a cured body of the thermally conductive composition.