LASER CUTTING HEAD FOR CUTTING HARD, BRITTLE PRODUCT AND LASER CUTTING DEVICE
The present disclosure relates to a laser cutting field, and in particular to a laser cutting head for cutting hard, brittle products and a laser cutting device for cutting hard, brittle products. The laser cutting head includes a polarizing element, a binary phase element and a focusing element. Th...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | The present disclosure relates to a laser cutting field, and in particular to a laser cutting head for cutting hard, brittle products and a laser cutting device for cutting hard, brittle products. The laser cutting head includes a polarizing element, a binary phase element and a focusing element. The polarizing element, the binary phase element and the focusing element are disposed in sequence. A laser light passes through the polarizing element to form a polarizing laser light. The polarizing laser light is emitted to the binary phase element, a diffractive laser light is formed in a location of the binary phase element. And then the diffractive laser light is emitted to the focusing element, a focusing laser light for cutting hard, brittle products is formed in a location of the focusing element. The laser light passes through the polarizing element, the binary phase element, and the focusing element in sequence. The laser light is finally converted into the focusing laser light which focal length is long and peak power density change of energy is uniform, where the laser light is ensured to penetrate the hard, brittle products to achieve the ideal effect of cutting hard, brittle products. |
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