SEPARATION METHOD FOR COMPOSITE MATERIAL

[Problem to be Solved]Provided is a method capable of dividing a composite material without causing a crack in an end face of a brittle material layer after being divided, or serious thermal deterioration of an end face of the resin layer after being divided.[Solution]The present invention is a meth...

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Bibliographische Detailangaben
1. Verfasser:	MATSUO, Naoyuki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	[Problem to be Solved]Provided is a method capable of dividing a composite material without causing a crack in an end face of a brittle material layer after being divided, or serious thermal deterioration of an end face of the resin layer after being divided.[Solution]The present invention is a method for dividing a composite material 10 in which a brittle material layer 1 and a resin layer 2 are laminated, the method including: a resin removing step of radiating a laser light L1 oscillated from a CO2 laser source 20 to the resin layer along the scheduled dividing line DL of the composite material and thereby forming a processed groove 24 along the scheduled dividing line; a brittle material removing step of radiating a laser light L2 oscillated from an ultrashort pulse laser source 30 to the brittle material layer along the scheduled dividing line and thereby forming a processing mark 11 along the scheduled dividing line, after the resin removing step; and a composite material dividing step of dividing the composite material by applying an external force along the scheduled dividing line after the brittle material removing step. The method is characterized in that the processing mark to be formed in the brittle material removing step is perforated through holes along the scheduled dividing line, and the pitch of the through holes is 10 µm or less.