METHOD FOR BONDING SUBSTRATE, TRANSPARENT SUBSTRATE LAMINATE, AND DEVICE PROVIDED WITH SUBSTRATE LAMINATE
[Summary]Methods of bonding substrates are provided, including forming a thin film of a metal oxide on a bonding surface of both or either of a pair of substrates, at least one of which is a transparent substrate, and contacting the bonding surfaces of the pair of substrates with each other via the...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | [Summary]Methods of bonding substrates are provided, including forming a thin film of a metal oxide on a bonding surface of both or either of a pair of substrates, at least one of which is a transparent substrate, and contacting the bonding surfaces of the pair of substrates with each other via the thin film of the metal oxide. |
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