METHOD FOR BONDING SUBSTRATE, TRANSPARENT SUBSTRATE LAMINATE, AND DEVICE PROVIDED WITH SUBSTRATE LAMINATE

[Summary]Methods of bonding substrates are provided, including forming a thin film of a metal oxide on a bonding surface of both or either of a pair of substrates, at least one of which is a transparent substrate, and contacting the bonding surfaces of the pair of substrates with each other via the...

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Bibliographische Detailangaben
Hauptverfasser: MATSUMOTO, Yoshiie, SUGA, Tadatomo
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:[Summary]Methods of bonding substrates are provided, including forming a thin film of a metal oxide on a bonding surface of both or either of a pair of substrates, at least one of which is a transparent substrate, and contacting the bonding surfaces of the pair of substrates with each other via the thin film of the metal oxide.