METHOD OF TREATING METAL SURFACE OF CERAMIC CIRCUIT BOARD

The present disclosure relates to a method of treating a metal surface of a ceramic circuit board, the method including a process of forming a roughening structure and an organic film on a metal surface of a ceramic circuit board using an etching composition, a degreasing process of removing the org...

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Bibliographische Detailangaben
1. Verfasser:	OH, Won Kyoung
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The present disclosure relates to a method of treating a metal surface of a ceramic circuit board, the method including a process of forming a roughening structure and an organic film on a metal surface of a ceramic circuit board using an etching composition, a degreasing process of removing the organic film formed on the roughening structure by bringing the ceramic circuit board on which the roughening structure is formed into contact with an alkali degreasing composition, and a process of washing the ceramic circuit board with an acidic solution after the degreasing process.