SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE

A semiconductor device comprises a substrate body (2) with a surface (3), a conductor (5) comprising a conductor material (5a) covering at least part of the surface (3), and a dielectric (4) that is arranged on a part of the surface (3) that is not covered by the conductor (5). Therein, the conducto...

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Bibliographische Detailangaben
Hauptverfasser:	BALAN, Viorel, FOURNEL, Frank, ROHRACHER, Karl, Dipl.-Ing, JOUVE, Amandine, HOFRICHTER, Jens, Dr, KASCHOWITZ, Manuel, CROORE, Romain, POELZL, Bernhard, MAITREJEAN, Sylvain
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MICROSTRUCTURAL TECHNOLOGY PERFORMING OPERATIONS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A semiconductor device comprises a substrate body (2) with a surface (3), a conductor (5) comprising a conductor material (5a) covering at least part of the surface (3), and a dielectric (4) that is arranged on a part of the surface (3) that is not covered by the conductor (5). Therein, the conductor (5) is in contact with the substrate body (2), the conductor (5) and the dielectric (4) form a layer (8), and a bonding surface (6) of the layer (8) has surface topographies of less than 10 nm, with the bonding surface (6) facing away from the substrate body (2). Moreover, the semiconductor device (1) is free of a diffusion barrier.