THERMOPLASTIC RESIN COMPOSITION AND MOLDED PRODUCT USING SAME

This disclosure relates to a thermoplastic resin composition comprising (A) 60 to 85 wt% of a (meth)acrylic resin, (B) 10 to 30 wt% of an acrylic graft copolymer, and (C) 5 to 10 wt% of a maleimide-based heat-resistant copolymer and a molded product using the same.

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Bibliographische Detailangaben
Hauptverfasser: KIM, Younghyo, KWON, Keehae, PARK, Jieun, KIM, In-Chol, SHIN, Hyeongseob
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:This disclosure relates to a thermoplastic resin composition comprising (A) 60 to 85 wt% of a (meth)acrylic resin, (B) 10 to 30 wt% of an acrylic graft copolymer, and (C) 5 to 10 wt% of a maleimide-based heat-resistant copolymer and a molded product using the same.